Construction and packaging techniques for electronic circuits and systems. Topics concentrate on computer-based circuit design, schematic capture, and printed circuit fabrication methods. Surface mount and through-hole design methods are covered. Single-layer and multi-layer printed circuit board computer-aided design techniques are developed. Additional topics include design considerations for heat, radio frequency interference, power distribution, assembly testing, and production standards. 3 Credits (3 Lecture) Prerequisite(s): EET202 or EET206. Fall Only.