Electronic Prototyping and Design


Construction and packaging techniques for electronic circuits and systems. Topics concentrate on computer-based circuit design, schematic capture, and printed circuit fabrication methods. Surface mount and through-hole design methods are covered. Single-layer and multi-layer printed circuit board computer-aided design techniques are developed. Additional topics include design considerations for heat, radio frequency interference, power distribution, assembly testing, and production standards. Fall Only.

3 Credits: 3 Lecture

EET202; or