Examination of a variety of measurements and techniques essential for device fabrication. Monitoring techniques, such as residual gas analysis (RGA), optical emission spectroscopy (OES), and end point detection, are discussed. Characterization techniques, such as SEM, XPS/Auger, surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurements, are used on real samples. Basic electrical measurements on device structures for yield analysis and process control are stressed, including breakdown measurements, junction testing, and C-V and I-V tests. 3 Credits (2 Lecture - 3 Lab)