Examination of the manufacturing issues involved in metal interconnects, dielectrics and final device assembly. Aluminum, refractory metals, and copper deposition techniques and characterization are discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing is emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing, and final test are examined. 3 Credits (2 Lecture - 3 Lab)