Basics of thin films, including growth, structure, mechanical properties, electrical properties, deposition equipment including atmospheric, low pressure, and plasma enhanced chemical vapor deposition and sputtering, thermal evaporation, and beam evaporation physical vapor deposition. Materials considered include dielectrics (nitride, oxide), polysilicon (doped and undoped), and metals (aluminum, tungsten, copper, adhesion promoters, diffusion barriers). Also covered are etching processes with emphasis on reactive ion etching (single wafer, batch), high-ion-density reactors (TCP, helicon, ECR, MERIE), and ion beam etching. Hands-on experience includes depositing and etching dielectric, semiconductor, and metal materials using state-of-the-art tools. 3 Credits (2 Lecture - 3 Lab) Prerequisite(s): EET271.