In-depth study of the thermal processing necessary for semiconductor fabrication. Growth and annealing processes, which utilize horizontal and vertical furnaces, are examined as well as rapid thermal annealing. Topics include single crystal growth (Czochralski, float-zone) as well as wafer slicing, etching, polishing, epitaxial growth, and substrate (bulk or epi) specifications. Also addressed is the impact of thermal processing and thermal processing history on defects, gettering, impurities, and overall device properties. Students grow and measure gate and field oxides, implant and activate source and drain regions, and evaluate thermal budget requirements using state-of-the-art tools. 3 Credits (2 Lecture - 3 Lab)